Yield and Thickness Loss

Continuous process improvements allow high yields of up to 99,5% and low thickness loss. 

Substrate removal depends on the incoming geometry, damage depth, and thickness differences of the wafer (in case of small volume orders). 

A thickness loss of less than 1 µm can be achieved. Depending on the quality of used wafers, a total removal of 10 µm is typical in a standard reclaim process.