White Light Interferometry

The white light interferometric microscope Profilm 3D allows exact process control of roughness and homogenity of the surfaces. Roughness of less than 0,2 nm is achieved for all materials. This is far below the critical value of 0,5 nm, necessary for e.g. direct wafer bonding.



WLI measurement of a InP wafer, ready for direct bonding. 


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