All wafers are inspected and sorted for the fitting process by experienced operators. Necessary removal and yield depend on careful inspection.
Chemomechanical planarization generate a flat and smooth surface. Several process steps are necessary to achieve defect-free surfaces with excellent TTV and roughness.
The surface of each wafer is measured for thickness, TTV, bow and warp to guarantee the excellent quality. The contact free method is provided by MTI on the Proforma 200 SA. Wafers up to 200mm can be measured.