General Reclaim

Layer Removal

The usual mechanical and chemical methods fail if you have to remove different kinds of layers from a compound semiconductor wafer. Our special removal step is the key process in our production. We remove all layers without damaging the substrate. This is mandatory to achieve the lowest substrate loss.


A multi-step polishing process generates products with atomically flat surfaces. All kinds of defects are removed. Interferometric measurements prove surface roughness of less than 0,2 nm. Single-side and double-side chemo-mechanical planarization processes are available. Quality control ensures excellent wafer-to-wafer uniformity. 




Wafer cleaning and particle inspection is performed in our cleanroom, Epi-Ready conditioning and sealed packaging ensures long shelf lifetime. Our wafers can be used directly in epitaxy without any additional pretreatment. 



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