Backside Thinning

We offer backside thinning. The front side of the wafer is protected by mounting it to a carrier (e.g. glas, sapphire or silicon, etc). We work with wafers mounted in your lab or we mount the wafers on carriers designed for you. Thinning with great precision is possible because the wafer is well protected against chemistry and fracture. Below you can see InP and GaAs wafers mounted on sapphire, glas and silicon.